Large band width (HBM) is mainly reserved for the most advanced equipment in terms of artificial intelligence in AMD or NVIDIA. However, according to the latest rumors, it will soon be available in devices that hold in the palm of the user’s hand.
Currently, the devices higher -end smartphones have an RAM -based memory based on low -consumption DDR5X technology (or LPDDR5X) for its speed and efficiency. Even its performance potential of around 68 gigabytes per second (GO/S) may soon not be enough, which could push manufacturers to make a significant upgrade.
The so -called next step in the RAM technology of mobile devices may be necessary to meet the requirements of an increasingly powerful artificial intelligence (AI).
On the other hand, the author of typically informed leaks fixed Focus Digital claims that the HBM memory for smartphone (or “mobile HBM”) cannot be used up to ~ 2TB/s but rather a new type of dram with large e/s with low latency (or LLW Dram), also recently developed to take charge of the features of AI.
It is supposed to reach new generation treatment speeds up to 128GB/s in its current form.
Regarding the first manufacturers of “HBM smartphones”, Apple and its iPhones could be a candidate of choice. The Cupertino giant is designed to be beaten by another smartphone manufacturer would be beaten by another, however.
It could be Huawei – although he himself is a manufacturer of RAM HBM and LLW, Samsung is also well placed to become a pioneer of this alleged upgrade.
