According to information from Semi -accommodated, Intel would have recently finalized the tape-out of its next high-end “Nova Lake-s” processor on the N2 engraving node (2 nm) from TSMC. A strategic choice which confirms the hybridization of manufacturing processes for this generation, Intel combining its own 18A technologies here with the know-how of TSMC to respond to the complexity and expected volumes.
Intel “Nova Lake-S”: a mixed manufacturing between 18a and TSMC N2
While rumors hitherto evoked an exclusive appeal to the 18a engraving of Intel (1.8 nm), it seems that Nova Lake-S will adopt a modular architecture with tiles engraved on different processes. The main compute, probably that integrating the CPU cores, was allegedly entrusted to TSMC in N2.
This decision can be explained by Intel’s desire to secure production in the event of insufficient delay or yield of its own nodeor simply for absorb a stronger demand than expected.
Objective: launch in the second half of 2026
The tape-out only marks the start of the validation process. Currently, the first chips are powered and tested in the laboratory. The stage of power-on usually takes a few weeks. Then comes the manufacturing phase in volume, which still requires two to three months of additional deadlines.
In the best of cases, Nova Lake-S would therefore be ready for marketing during the third quarter of 2026.
A promising technical sheet
According to the already known elements, Nova Lake-s will combine:
- A total of 52 cores : 16 P-Cores, 32 e-cores and 4 LPE-core
- A memory controller supporting until 8800 MT/s
- An integrated GPU based on architecture Xe3 « Celestial »
- A multimedia block and display managed by Xe4 « Druid »
A very ambitious chip therefore, both technical and logistically. The industrial challenge remains important, and Intel is focusing here on a multi-fond approach to guarantee the success of its future platform.