At the end of April, Intel Foundry held his Direct Connect 2025. An event to which our Nicolas had also assisted. He already presented the subject that we will approach in our news of the day: Intel’s wish to include a waterblock directly in the IHS of its processors. In an attempt to contact us as many people as possible, desolate suddenly for enthusiasts who already know all this very well, let us remember that current processors have a small plaque (generally copper) baptized on their surface IHS (Integrated Heat Spreader) which is used to protect the very fragile fleas of the processor, while penalizing thermal exchanges as little as possible with the coolers that the user then comes to install over it. This additional interface in thermal exchange, however, still induces a slight drop in inevitable performance, to the point that some advanced users will sometimes remove the IHS to grab some additional degrees: the famous “Delid”.
On the Intel side, and while the consumption of CPUs and their temperature is a notable brake on the evolution of their performance and characteristics, we therefore actively work to develop waterblocks which directly take the place of the IHS on the surface of the processor. In Nicolas’s article in connection a little higher, we can see on the first cliché what it might look like:
Do you see the name of the person who holds this prototype while Nicolas takes a picture of it? Rajiv Mongia? Well we find in this mid-August this senior thermal architecture in Intel Foundry, who tells us again about this “Advanced thermal interface” in a short video posted on the official Youtube channel of Intel:
The opportunity to discover that the subject is not at all abandoned and even that Intel seems to really bet on it for the future. Mongia begins by explaining the different levels in which are work of thermal architect intervenes, before presenting a classic IHS (or LID) and therefore to explain that Intel Foundry “does not stop there and works to integrate the circulation of liquid directly inside the IHS.”. He then shows, but the camera is struggling to focus, the interior of a prototype. As he confirms, but Nicolas already told you about it 3 months ago, the idea is to be able to offer a complete product to customers with the chip and his waterblock integrated directly, in a ready -to -use packaging where it only remains to connect the tubes of his watercooling.
Mongia concludes her video by estimating that this type of advanced cooling solution becomes important in these times when AI -related performance requests are increasingly important, so that CPUs can best follow the rate of GPU surpulars in order to “extract the maximum performance” ‘. We feel the call of the foot in an attempt to convince partners of follows Intel Foundry in his project, the magic word “AI” being released.
