The 20 companies responding to the biggest AI issues

As in any technological development, advances in artificial intelligence are accompanied by a procession of challenges. For example, Today, AI comes up against increasingly significant data volumes, and always higher speed of execution. Consequently, Three issues then become central: heat, data flow management and energy efficiency. Nevertheless, Here are four technologies that provide concrete answers to these issues. Furthermore, and the companies that seem to us to be the best positioned in these segments.

Photonics on silicon – 20 companies responding biggest ai

Photonics on silicon (or SIPH) designates the application of photonics to silicon semiconductors. Therefore, The principle: replace technically limited copper cables with optical links capable of transmitting data via infrared wavelengths. Similarly, It is in this 20 companies responding biggest ai area that the co-packaged optics, or CPO (article to read here), in particular. Meanwhile, A bit like the transition from ADSL to fiber for the Internet. Consequently, this technology would make it possible to pass more data, by limiting heating and energy consumption. Similarly, A promise that already attracts giants from the sector.

• Intel Presented the first fully integrated two-way optical chiplet, co-pauck with an Intel processor, capable of transmitting 4 TB/s on optical fiber up to 100 meters. Therefore, A technology designed to meet the growing needs of IA infrastructure, both in bandwidth and energy efficiency.
• Cisco Adopt a double strategy: on the one hand, high speed plug -in optical modules; On the other hand, active work on the direct integration of optical modules into the switches of switches, in other words the famous CPO 20 companies responding biggest ai technology.
• Broadcomleader in communication fleas, is an essential player in photonics on silicon. He already integrates this technology into his Tomahawk chips. with Ethernet Bailly switches embarking eight optical engines, for a density and an efficiency of bandwidth maximized.
• Marvelllagging behind other segments, invests heavily in integrated photonic engines, capable of replacing conventional electrical interconnections with more efficient optical solutions.
• Nvidia took advantage of the GTC 2025 to unveil two ranges of photonic network switches (Spectrum-X Photonics and Quantum-X Photonics), integrating CPO technology and merging electronic and optical components in a single case.
• Lumentum Holdingspure player in the optical sector, draws 80 % of its cloud income and networks. Its catalog includes transceives and wavelength managers.

The fourth generation of HBM – 20 companies responding biggest ai

The HBM fleas (High Bandwidth Memory) have become essential in the development of AI. Integrated into the GPUs to build modern graphics cards, they meet the growing need for massive data processing. Three major players are competing for the first validation by Nvidia of a fourth generation HBM chip.

• SK Hynixdesigner of the first HBM chip in 2013, is today the leader in the sector. It benefits from an impressive dynamic, with +70 % over the last three months.
• Micronlong considered outsider, now seems to be elbow with the Korean. His scholarship course, up +75 % over the same period, testifies to his reinforced position in the race.
• Samsungfor its part, has a solid memory pole, but accumulates delays. Its dynamics remain behind, but could switch if a strategic turning point is operated.

Advanced packaging techniques

Buying a NVIDIA H100 chip is not only to acquire a GPU, but a full card bringing together GPU, HBM memory, PCI Express connectors and other components. This set requires very high level technical packaging, because it directly influences thermal dissipation, bandwidth or consumption. Several companies specialize in this decisive aspect of production.

• TSMC has developed Cowos technology, which overlaps several memory chips near the processor. The objective: to reduce latency, improve thermal dissipation, and boost the bandwidth. A particularly well thought out structure.
• Intel Building on its EMIB and FOVEROS technologies, which make it possible to assemble chiplets like a 3D puzzle. Faced with the end of the traditional scaling, this modular packaging represents one of its most serious assets against TSMC.
• Amkor offers a wide range of 20 companies responding biggest ai advanced technologies. The System-In-Package (SIP) allows you to integrate processors, memories and antennas into a single module. The Flip Chip ensures better thermal dissipation, and the Wafer-Level Packaging (WLP) allows extensive miniaturization. Finally, 2.5D/3D stacks boost performance in AI applications and autonomous vehicles.
• ASE TechnologyTaiwanese giant of packaging and flea test, uses several advanced techniques: fan-out, 2.5D/3D IC, or SIP. Approaches that have become essential in AI, chiplets and smartphones.
• JCETone of the Chinese leaders in the sector, develops the XDFOI, its own version of the high density fan-out, ideal for AI and the automobile. The company also relies on SIP and 2.5D/3D packaging, while producing RF modules with integrated antennas adapted to 5G and IoT.

Cooling solutions

Faced with increasingly powerful and solicited GPUs, cooling becomes a critical issue. It 20 companies responding biggest ai intervenes at different levels: at the very heart of the chip. in the racks that welcome them, and in the global environment of the data center. Here are some names to watch closely.

• AstekDanish company specializing in liquid cooling, designs systems replacing the fans with water for better thermal dissipation. Its flagship technology, direct cooling on chip (D2C), notably targets IA servers.
• Schneider ElectricFrench flagship founded in 1836, offers complete solutions, from food to liquid cooling, via its Motivair brand. It also offers a software suite (Ecostruxure) to supervise and optimize in real time the energy efficiency of infrastructure.
• VerticalAmerican company born in 2016, provides direct cooling equipment or immersion (cool immersion, coolchip CDU) as well as hybrid solutions. It supports its products with software supervision and installation or maintenance services.
• Carrieranother American actor, 20 companies responding biggest ai specializes in industrial cooling. Additionally, It offers cold groups, heat recovery solutions, and a software platform, Quantumleap, dedicated to thermal optimization in real time.
• Dellfinally, is not satisfied with his PCs. Its Poweredge servers and its “Integrated Rack Scalable Systems” racks are cut for high density AI. Air cooling (Smart Flow). direct-to-chip liquid (DLC), full thermal capture with the PowerCool Erdhx door: the company pushes the energy optimization, with up to 192 GPU Blackwell Ultra by Rack.